TLV333, TLV2333, TLV4333

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SBOS751 – DECEMBER 2015

7.4 Thermal Information: TLV333

TLV333

D

DBV

DCK

UNIT

(SOIC)

(SOT23)

(SC70)

8 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

140.1

220.8

298.4

°C/W

Junction-to-case (top) thermal resistance

89.8

97.5

65.4

°C/W

Junction-to-board thermal resistance

80.6

61.7

97.1

°C/W

Junction-to-top characterization parameter

28.7

7.6

0.8

°C/W

Junction-to-board characterization parameter

80.1

61.1

95.5

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Thermal Information: TLV2333

TLV2333

D

DGK

UNIT

(SOIC)

(VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

124.0

180.3

°C/W

Junction-to-case (top) thermal resistance

73.7

48.1

°C/W

Junction-to-board thermal resistance

64.4

100.9

°C/W

Junction-to-top characterization parameter

18.0

2.4

°C/W

Junction-to-board characterization parameter

63.9

99.3

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.6 Thermal Information: TLV4333

TLV4333

D

PW

UNIT

(SOIC)

(TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

83.8

120.8

°C/W

Junction-to-case (top) thermal resistance

70.7

34.3

°C/W

Junction-to-board thermal resistance

59.5

62.8

°C/W

Junction-to-top characterization parameter

11.6

1.0

°C/W

Junction-to-board characterization parameter

37.7

56.5

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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Product Folder Links: TLV333 TLV2333 TLV4333