LMV931-N datasheet(4/40 Pages) TI1

Part #	LMV931-N

Description	Single, Dual, Quad 1.8-V, RRIO Operational Amplifiers

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Manufacturer	TI1 [Texas Instruments]

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LMV931-N, LMV931-N-Q1

LMV932-N, LMV932-N-Q1, LMV934-N, LMV934-N-Q1

SNOS993O – NOVEMBER 2001 – REVISED DECEMBER 2014

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2).

MIN

MAX

UNIT

Supply voltage ( V+– V− )

–0.3

6

Differential input voltage

V-

V+

V

Voltage at input/output pins

(V- ) - 0.3

(V+) + 0.3

Junction temperature(3)

–40

150

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate

conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.2 Handling Ratings - Commercial

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-

–2000

2000

001, all pins(1) (2)

Electrostatic

V(ESD)

Charged device model (CDM), per JEDEC specification

V

discharge

–750

750

JESD22-C101, all pins(3)

Machine Model (MM)(4)

–200

200

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

(3)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

(4)

Machine model, 200

Ω in series with 100-pF.

6.3 Handling Ratings - Automotive

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per AEC Q100-002(1)

–2000

2000

V(ESD)

Electrostatic discharge

Charged device model (CDM), per AEC Q100-011

–750

750

V

Machine Model (MM)(2)

–200

200

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

(2)

Machine model, 200

Ω in series with 100-pF.

6.4 Recommended Operating Ratings

See

(1).

MIN

MAX

UNIT

Supply Voltage Range ( V+– V− )

1.8

5.5

V

Temperature Range

−40

125

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate

conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test

conditions, see the Electrical Characteristics.

6.5 Thermal Information

LMV921

LMV922

LMV924

THERMAL METRIC(1)

DCK

DBV

DGK

D

DGK

D

UNIT

5 PINS

8 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

414

265

235

175

155

127

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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