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Vishay Sfernice

Revision: 20-Feb-15

6

Document Number: 53017

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Option: Marking

Option to order 0013:



Marking of ohmic value and tolerance:



Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)



Sizes: 1206 to 2512: 4 digits marking (same codification than in the ordering procedure)



Tolerance indicated by a color dot.

Option to order 0014:



Marking of ohmic value:



Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)



Sizes: 1206 to 2512: 4 digits marking (same codification than in the ordering procedure)



No standard marking available for smaller sizes.



A price adder will apply to the unit price of the parts for options 0013 and 0014.

Option: AEC-Q200

For moisture resistance test only.

Option to Order 0058:



Specific production process to withstand 85 °C/85 % at Pn/10

PACKAGING

ESD packaging available: waffle-pack, and plastic tape and

reel (low conductivity). Paper tape available in standard (for

size 0402) and upon request (ESD only) (for size 0603, 0805,

and 1206).

PACKAGING RULES

Waffle Pack

Can be filled up to maximum quantity indicated in the table

here above, taking into account the minimum order quantity.

When quantity ordered exceeds maximum quantity of a

single waffle pack, the waffle packs are stacked up on the

top of each other and closed by one single cover.

To get “not stacked up” waffle pack in case of ordered

quantity > maximum number of pieces per package:

Please consult Vishay Sfernice for specific ordering

code.

Tape and Reel

See Part Numbering information to get the quantity desired

by tape.

Notes

SIZE

MOQ

NUMBER OF PIECES PER PACKAGE

TAPE

WIDTH

WAFFLE PACK

2" × 2"

TAPE AND REEL

MIN.

MAX.

0302

250

340

100

5000

8 mm

0402

100

0505

100

4000

0603

5000

0805

4000

1005

221

1206

140

1505

60

2010

2000

2512

50

PERFORMANCE

TESTS

CONDITIONS

MIL OR CECC

REQUIREMENTS

TYPICAL

PERFORMANCES

Thermal shock

MIL-PRF-55342G

MIL-STD-202 F-Method 107 F

± 0.05 %

± 0.02 %

Short time overload

MIL-PRF-55342G

PARA 3.10.4.7.5

± 0.05 %

± 0.01 %

Low temperature operation

MIL-PRF-55342G

PARA 3.9 and 4.7.4

± 0.05 %

± 0.01 %

Resistance to solder heat

MIL-PRF-55342G

PARA 3.12, 4.7.7, 4.7.1.2

± 0.05 %

± 0.03 %

Moisture resistance

MIL-PRF-55342G

PARA 3.13 and 4.7.8

MIL-STD-202 F-Method 106 E

± 0.10 %

± 0.01 %

CECC 56 days/40 °C/93 % RH

± 0.10 %

± 0.01 %

85 °C/85 % RH/Pn/10, 1000 h

± 0.5 % + 0.05



Max. < 0.3 % + 0.05



High temperature

MIL-PRF-55342G

PARA 3.11 and 4.7.6

± 0.05 %

± 0.05 %

Load life

MIL-PRF-55342G

8000 h Pn at 70 °C

MIL-STD-202 F-Method 108 A

± 0.5 %