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8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT55L512L18P_2.p65 – Rev. 6/01

©2001, Micron Technology, Inc.

8Mb: 512K x 18, 256K x 32/36

PIPELINED ZBT SRAM

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micron.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992

Micron is a registered trademark of Micron Technology, Inc.

ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc.,

and the architecture is supported by Micron Technology, Inc., and Motorola Inc.

Ø

7.62

20.32

19.94 ±0.10

11.94 ±0.10

1.27 (TYP)

1.27 (TYP)

0.60 ±0.10

2.40 MAX

0.90 ±0.10

14.00 ±0.10

22.00 ±0.20

A1 CORNER

A1 CORNER

(dimension applies to a

noncollapsed solder ball)

Substrate material:

BT resin laminate

0.15

SEATING PLANE

0.75 ±0.15

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

2. Solder ball land pad is 0.6mm.

119-PIN BGA