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8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT55L512L18P_2.p65 – Rev. 6/01

©2001, Micron Technology, Inc.

8Mb: 512K x 18, 256K x 32/36

PIPELINED ZBT SRAM

165-PIN FBGA

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

10.00

14.00

15.00 ±0.10

1.00

TYP

1.00

TYP

5.00 ±0.05

13.00 ±0.10

PIN A1 ID

PIN A1 ID

BALL A1

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

6.50 ±0.05

7.00 ±0.05

7.50 ±0.05

1.20 MAX

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb

SOLDER BALL PAD: Ø .33mm

SOLDER BALL DIAMETER REFERS

TO POST REFLOW CONDITION. THE

PRE-REFLOW DIAMETER IS Ø 0.40

SEATING PLANE

0.85 ±0.075

0.12 C

C

165X Ø 0.45

BALL A11