15

8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT55L512L18P_2.p65 – Rev. 6/01

©2001, Micron Technology, Inc.

8Mb: 512K x 18, 256K x 32/36

PIPELINED ZBT SRAM

x 1 8

x32/x36

SYMBOL TYPE

DESCRIPTION

3D, 3E, 3F,

3D, 3E, 3F,

Supply Ground: GND.

3H, 3K, 3L,

3H, 3K, 3M,

3M, 3N, 3P,

3N, 3P, 5D,

5D, 5E, 5F,

5E, 5F, 5H,

5G, 5H, 5K,

5K, 5M, 5N,

5M, 5N, 5P

5P

2U, 3U, 4U,

2U, 3U, 4U,

D N U

–

Do Not Use: These signals may either be unconnected or wired

5 U

5 U

to GND to improve package heat dissipation.

1B, 1C, 1E,

1B, 1C, 1R,

N C

–

No Connect: These signals are not internally connected and

1G, 1K, 1P,

1T, 2T, 3J,

may be connected to ground to improve package heat

1R, 1T, 2D,

4D, 4L, 5J,

dissipation.

2F, 2H, 2L,

6T, 6U, 7B,

2N, 3J, 4D,

7C, 7R

4L, 4T, 5J,

6E, 6G, 6K,

6M, 6P, 6U,

7B, 7C, 7D,

7H, 7L, 7N,

7R

NF

—

No Function: These pins are internally connected to the die and

have the capacitance of an input pin. It is allowable to leave

these pins unconnected or driven by signals.

BGA PIN DESCRIPTIONS (continued)