11

8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT55L512L18P_2.p65 – Rev. 6/01

©2001, Micron Technology, Inc.

8Mb: 512K x 18, 256K x 32/36

PIPELINED ZBT SRAM

x18

x32/x36

SYMBOL

TYPE

DESCRIPTION

4C, 4N, 5C,

4C, 4N, 5C,

Supply Ground: GND.

5D, 5E, 5F, 5G, 5D, 5E, 5F, 5G,

5H, 5J, 5K, 5L, 5H, 5J, 5K, 5L,

5M, 6C, 6D,

5M, 6C, 6D,

6E, 6F, 6G, 6H, 6E, 6F, 6G, 6H,

6J, 6K, 6L, 6M, 6J, 6K, 6L, 6M,

7C, 7D, 7E, 7F, 7C, 7D, 7E, 7F,

7G, 7H, 7J, 7K, 7G, 7H, 7J, 7K,

7L, 7M, 8C, 8N 7L, 7M, 8C, 8N

5P, 7P, 5R, 7R 5P, 7P, 5R, 7R

DNU

–

Do Not Use: These signals may either be unconnected or wired to

GND to improve package heat dissipation.

1A, 1B, 1C, 1D,

1A, 1B, 1P,

NC

–

No Connect: These signals are not internally connected and may be

1E, 1F, 1G,

2C, 2N, 2P,

connected to ground to improve package heat dissipation.

1P, 2C, 2J, 2K, 2R, 3H, 5N,

Pin 9B is reserved for address pin expansion; 16MB.

2L, 2M, 2N,

6N, 9B, 9H,

2P, 2R, 3H, 4B, 10C, 10H, 10N,

5A, 5N, 6N,

11A, 11B, 11P

9B, 9H, 10C,

10D, 10E, 10F,

10G, 10H, 10N,

11B, 11J, 11K,

11L, 11M,

11N, 11P

NF

—

No Function: These pins are internally connected to the die and

have the capacitance of an input pin. It is allowable to leave

these pins unconnected or driven by signals.

FBGA PIN DESCRIPTIONS (CONTINUED)