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8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT55L512L18P_2.p65 – Rev. 6/01

©2001, Micron Technology, Inc.

8Mb: 512K x 18, 256K x 32/36

PIPELINED ZBT SRAM

8Mb

FEATURES

• High frequency and 100 percent bus utilization

• Fast cycle times: 6ns, 7.5ns and 10ns

• Separate +3.3V or +2.5V isolated output buffer

• Advanced control logic for minimum control

signal interface

• Individual BYTE WRITE controls may be tied LOW

• Single R/W# (read/write) control pin

• CKE# pin to enable clock and suspend operations

• Three chip enables for simple depth expansion

• Clock-controlled and registered addresses, data

I/Os and control signals

• Internally self-timed, fully coherent WRITE

• Internally self-timed, registered outputs to

eliminate the need to control OE#

• SNOOZE MODE for reduced-power standby

• Common data inputs and data outputs

• Linear or Interleaved Burst Modes

• Burst feature (optional)

• Pin/function compatibility with 2Mb, 4Mb, and

18Mb ZBT SRAM

• Automatic power-down

• 100-pin TQFP package

• 165-pin FBGA package

• 119-pin BGA package

OPTIONS

MARKING*

• Timing (Access/Cycle/MHz)

3.5ns/6ns/166 MHz

-6

4.2ns/7.5ns/133 MHz

-7.5

5ns/10ns/100 MHz

-10

• Configurations

3.3V I/O

512K x 18

MT55L512L18P

256K x 32

MT55L256L32P

256K x 36

MT55L256L36P

2.5V I/O

512K x 18

MT55L512V18P

256K x 32

MT55L256V32P

256K x 36

MT55L256V36P

• Package

100-pin TQFP

T

165-pin, 13mm x 15mm FBGA

F

119-pin, 14mm x 22mm BGA

B

• Operating Temperature Range

Commercial (0ºC to +70ºC)

None

Industrial (-40°C to +85°C)**

IT

MT55L512L18P, MT55L512V18P,

MT55L256L32P, MT55L256V32P,

MT55L256L36P, MT55L256V36P

* A Part Marking Guide for the FBGA devices can be found on Micron’s

web site—http://www.micron.com/support/index.html.

** Industrial temperature range offered in specific speed grades and

confgurations. Contact factory for more information.

Part Number Example:

MT55L256L32PT-7.5

* A Part Marking Guide for the FBGA devices can be found on Micron’s

web site—http://www.micron.com/support/index.html.

** Industrial temperature range offered in specific speed grades and

confgurations. Contact factory for more information.

NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).

2. JEDEC-standard MS-028 BHA (PBGA).

165-Pin FBGA

(Preliminary Package Data)