7SB3126

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8

PACKAGE DIMENSIONS

ULLGA6 1.0x1.0, 0.35P

CASE 613AD−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

A

B

E

D

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

L

5X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

6X

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

L1

1

3

4

6

DIM MIN

MAX

MILLIMETERS

A

−−−

0.40

A1

0.00

0.05

b

0.12

0.22

D

1.00 BSC

E

1.00 BSC

e

0.35 BSC

L

0.25

0.35

L1

0.30

0.40

NOTE 4

SOLDERMASK DEFINED*

DIMENSIONS: MILLIMETERS

0.22

5X

0.48

6X

1.18

0.53

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.35

1

MOUNTING FOOTPRINT

PKG

OUTLINE