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LM3253 Datasheet(PDF) 4 Page - Texas Instruments |
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LM3253 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page LM3253 SNVS791Q – FEBRUARY 2012 – REVISED MAY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VDD, PVIN to SGND −0.2V to +6.0V PGND to SGND −0.2V to +0.2V EN, FB, VCON, BP, MODE (SGND −0.2V) to (VDD +0.2V) SW, ACB (PGND −0.2V) to (PVIN +0.2V PVIN to VDD −0.2V to +0.2V Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature +260°C (Soldering, 10 sec) ESD Rating(5)(6) Human Body Model 2kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pins. The LM3253 is designed for mobile phone applications where turn-on after power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage exceeds 2.7V. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 130°C (typ.). (5) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200 pF capacitor discharged directly into each pin. (6) Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling procedures can result in damage. 4 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LM3253 |
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