LM3243

SNVS782C – OCTOBER 2010 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VDD, PVIN to SGND

−0.2

6

V

PGND to SGND

−0.2

0.2

V

EN, FB, VCON, BP, MODE

(SGND

− 0.2)

(VDD + 0.2)

V

SW, ACB

(PGND

− 0.2)

(PVIN + 0.2)

V

PVIN to VDD

−0.2

0.2

V

Internally limited

150

°C

Maximum lead temperature

(soldering, 10 sec)

150

°C

−65°

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Recommended Operating Conditions are

conditions under which operation of the device is specified. Operating Ratings do not imply verified performance limits. For performance

limits and associated test conditions, see Electrical Characteristics .

(3)

All voltages are with respect to the potential at the GND pins. The LM3243 is designed for mobile phone applications where turnon after

power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal

undervoltage lock-out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage exceeds

2.7 V.

(4)

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

Input voltage

2.7

5.5

V

Recommended load current

2.5

A

−30

125

°C

(3)

−30

90

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins. The LM3243 is designed for mobile phone applications where turnon after

power up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal

undervoltage lock-out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage exceeds

2.7 V.

(3)

In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

duty cycle usage is assumed to drop (that is, max power 12.5% usage is assumed) for 2G mode.

4

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