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TPS7A3401 Datasheet(PDF) 19 Page - Texas Instruments |
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TPS7A3401 Datasheet(HTML) 19 Page - Texas Instruments |
19 / 27 page TPS7A3401 www.ti.com SBVS163A – JUNE 2011 – REVISED MAY 2015 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 Evaluation Modules An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS7A3401. The TPS7A3401EVM-042 evaluation module (and related user's guide) can be requested at the Texas Instruments website through the product folders or purchased directly from the TI eStore. 11.1.1.2 Spice Models Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS7A3401 is available through the product folder under the Tools & Software tab. 11.2 Documentation Support 11.2.1 Related Documentation For related documentation see the following: • Pros and Cons of Using a Feedforward Capacitor with a Low-Dropout Regulator, SBVA042. • Using New Thermal Metrics, SBVA025. • TPS7A3401EVM-042 Evaluation Module User's Guide, SLVU428. 11.3 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links: TPS7A3401 |
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