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ICM7555CBA Datasheet(PDF) 3 Page - Intersil Corporation |
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ICM7555CBA Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 12 page ![]() 3 FN2867.9 August 24, 2006 Absolute Maximum Ratings Thermal Information Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+18V Input Voltage Trigger, Control Voltage, Threshold, Reset (Note 1) . . . . . . . . . . . . . . . . . . . . . V+ +0.3V to GND -0.3V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA Operating Conditions Temperature Range ICM7555C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C ICM7555I, ICM7556I . . . . . . . . . . . . . . . . . . . . . . -25°C to +85°C ICM7556M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Thermal Resistance (Typical, Note 2) θJA (°C/W) θJC (°C/W) 14 Lead CERDIP Package. . . . . . . . . . 80 24 14 Lead PDIP Package* . . . . . . . . . . . 115 N/A 8 Lead PDIP Package* . . . . . . . . . . . . 130 N/A 8 Lead SOIC Package . . . . . . . . . . . . . 170 N/A Maximum Junction Temperature (Hermetic Package) . . . . . . . +175°C Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C (SOIC - Lead Tips Only) * Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than V+ +0.3V or less than V- -0.3V may cause destructive latchup. For this reason it is recommended that no inputs from external sources not operating from the same power supply be applied to the device before its power supply is established. In multiple supply systems, the supply of the ICM7555 and ICM7556 must be turned on first. 2. θ JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief 379 for details. Electrical Specifications Applies to ICM7555 and ICM7556, unless otherwise specified PARAMETER SYMBOL TEST CONDITIONS TA = +25°C (NOTE 4) -55°C TO +125°C UNITS MIN TYP MAX MIN TYP MAX Static Supply Current IDD ICM7555 VDD = 5V 40 200 300 μA VDD = 15V 60 300 300 μA ICM7556 VDD = 5V 80 400 600 μA VDD = 15V 120 600 600 μA Monostable Timing Accuracy RA = 10K, C = 0.1μF, VDD = 5V 2 % 858 1161 μs Drift with Temperature (Note 3) VDD = 5V 150 ppm/ °C VDD = 10V 200 ppm/ °C VDD = 15V 250 ppm/ °C Drift with Supply (Note 3) VDD = 5V to 15V 0.5 0.5 %/V Astable Timing Accuracy RA = RB = 10K, C = 0.1μF, VDD = 5V 2 % 1717 2323 μs Drift with Temperature (Note 3) VDD = 5V 150 ppm/ °C VDD = 10V 200 ppm/ °C VDD = 15V 250 ppm/ °C Drift with Supply (Note 3) VDD = 5V to 15V 0.5 0.5 %/V Threshold Voltage VTH VDD = 15V 62677161 72 % VDD Trigger Voltage VTRIG VDD = 15V 28323627 37 % VDD Trigger Current ITRIG VDD = 15V 10 50 nA Threshold Current ITH VDD = 15V 10 50 nA Control Voltage VCV VDD = 15V 62677161 72 % VDD ICM7555, ICM7556 |
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