NXP Semiconductors

PMV130ENEA

40 V, N-channel Trench MOSFET

PMV130ENEA

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Product data sheet

12 June 2014

5 / 16

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to solder

point

-

20

25

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

aaa-011955

10

1

10

(K/W)

1

0

0.02

0.05

0.25

0.33

0.75

duty cycle = 1

0.01

0.50

0.10

0.20

FR4 PCB, standard footprint

Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-011956

10

1

10

(K/W)

1

0 0.01

0.02

0.05

0.10

0.20

0.25

0.33

0.50

0.75

duty cycle = 1

Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values