NXP Semiconductors

PMZB550UNE

30 V, N-channel Trench MOSFET

PMZB550UNE

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Product data sheet

25 March 2015

11 / 15

13. Soldering

1.3

0.3

0.6

0.7

0.4

0.9

0.3

(2x)

0.4

(2x)

0.25

(2x)

R0.05 (8x)

0.7

Footprint information for reflow soldering

SOT883B

sot883b_fr

occupied area

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

Fig. 20. Reflow soldering footprint for DFN1006B-3 (SOT883B)