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MAX2601-MAX2602 Datasheet(PDF) 5 Page - Maxim Integrated Products

Part # MAX2601-MAX2602
Description  3.6V, 1W RF Power Transistors for 900MHz Applications
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX2601-MAX2602 Datasheet(HTML) 5 Page - Maxim Integrated Products

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3.6V, 1W RF Power Transistors
for 900MHz Applications
_______________________________________________________________________________________
5
__________Applications Information
Optimum Port Impedance
The source and load impedances presented to the
MAX2601/MAX2602 have a direct impact upon its gain,
output power, and linearity. Proper source- and load-
terminating impedances (ZS and ZL) presented to the
power transistor base and collector will ensure optimum
performance.
For a power transistor, simply applying the conjugate of
the transistor’s input and output impedances calculated
from small-signal S-parameters will yield less than opti-
mum device performance.
For maximum efficiency at VBB = 0.75V and VCC =
3.6V, the optimum power-transistor source and load
impedances (as defined in Figure 3) are:
At 836MHz:
ZS = 5.5 + j2.0
ZL = 6.5 + j1.5
At 433MHz:
ZS = 9.5 - j2.5
ZL = 8.5 - j1.5
ZS and ZL reflect the impedances that should be pre-
sented to the transistor’s base and collector. The pack-
age parasitics are dominated by inductance (as shown
in Figure 3), and need to be accounted for when calcu-
lating ZS and ZL.
The internal bond and package inductances shown
in Figure 3 should be included as part of the end-
application matching network, depending upon exact
layout topology.
Slug Layout Techniques
The most important connection to make to the
MAX2601/MAX2602 is the back side. It should connect
directly to the PC board ground plane if it is on the top
side, or through numerous plated through-holes if the
ground plane is buried. For maximum gain, this con-
nection should have very little self-inductance. Since it
is also the thermal path for heat dissipation, it must
have low thermal impedance, and the ground plane
should be large.
ZS
ZL
2.8nH
2.8nH
2.8nH
2.8nH
1
2
3
4
8
7
6
5
MAX2601
MAX2602
Figure 3. Optimum Port Impedance


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