IR2156(S)PbF

2

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur.

All voltage

parameters are absolute voltages referenced to COM, all currents are defined positive into any lead.

The Thermal

Resistance and Power Dissipation ratings are measured under board mounted and still air conditions.

Symbol

Definition

Min.

Max.

Units

VB

High side floating supply voltage

-0.3

625

V

VS

High side floating supply offset voltage

VB - 25

VB + 0.3

VHO

High side floating output voltage

VS - 0.3

VB + 0.3

VLO

Low side output voltage

-0.3

VCC + 0.3

IOMAX

Maximum allowable output current (HO, LO)

due to external power transistor miller effect

-500

500

mA

VDC

VDC pin voltage

-0.3

VCC+0.3

V

VCT

CT pin voltage

-0.3

VCC+0.3

VCPH

CPH pin voltage

-0.3

VCC+0.3

ICPH

CPH pin current

-5

5

mA

IRPH

RPH pin current

-5

5

VRPH

RPH pin voltage

-0.3

VCC+0.3

V

IRT

RT pin current

-5

5

mA

VRT

RT pin voltage

-0.3

VCC+0.3

V

VCS

Current sense pin voltage

-0.3

5.5

ICS

Current sense pin current

-5

5

mA

ISD

Shutdown pin current

-5

5

ICC

Supply current (Note 1)

-20

20

dV/dt

Allowable offset voltage slew rate

-50

50

V/ns

PD

Package power dissipation @ TA ≤ +25ºC

(14-Pin DIP)

(14-Pin SOIC)

---

1.80

W

---

1.40

R

θJA

Thermal resistance, junction to ambient

(14-Pin DIP)

---

70

ºC/W

(14-Pin SOIC)

---

82

TJ

Junction temperature

-55

150

TS

Storage temperature

-55

150

ºC

TL

Lead temperature (soldering, 10 seconds)

---

300

Note 1: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown

voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than

the VCLAMP specified in the Electrical Characteristics section.