M13S2561616A-2S datasheet(6/49 Pages) ESMT

Part #	M13S2561616A-2S

Description	Double-data-rate architecture, two data transfers per clock cycle

Download	49 Pages

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Manufacturer	ESMT [Elite Semiconductor Memory Technology Inc.]

Direct Link	http://www.esmt.com.tw/index.asp

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6 / 49 page

ESMT

M13S2561616A (2S)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc.

Publication Date : Jan. 2015

Revision : 1.0

6/49

IDD Parameters and Test Conditions

Test Condition

Symbol

Note

Operating Current (one bank Active - Precharge):

tRC = tRC (min); tCK = tCK (min); DQ, DM, and DQS inputs changing once per clock cycle;

Address and control inputs changing once every two clock cycles; CS = high between valid commands.

IDD0

Operating Current (one bank Active - Read - Precharge):

One bank open; BL = 4; tRC = tRC (min); tCK = tCK (min); IOUT = 0mA;

Address and control inputs changing once per deselect cycle; CS = high between valid commands

IDD1

2

Precharge Power-down Standby Current:

All banks idle; Power-down mode; tCK = tCK (min); CKE ≤ VIL(max); VIN = VREF for DQ, DQS and DM.

IDD2P

Precharge Floating Standby Current:

CS

≥ VIH(min); All banks idle; CKE ≥ VIH(min); tCK = tCK (min);

Address and other control inputs changing once per clock cycle; VIN = VREF for DQ, DQS, and DM.

IDD2F

Precharge Quiet Standby Current:

CS

≥ VIH(min); All banks idle; CKE ≥ VIH(min); tCK = tCK (min);

Address and other control inputs stable at

≥ VIH(min) or ≤ VIL(max); VIN = VREF for DQ, DQS, and DM.

IDD2Q

Active Power-down Standby Current:

One bank active; Power-down mode; CKE

≤ VIL(max); tCK = tCK (min); VIN = VREF for DQ, DQS, and DM.

IDD3P

Active Standby Current:

CS

≥ VIH(min); CKE ≥ VIH(min); One bank active; tRC = tRAS (max); tCK = tCK (min);

DQ, DM, and DQS inputs changing twice per clock cycle;

Address and other control inputs changing once per clock cycle.

IDD3N

Operating Current (burst read):

BL = 2; Continuous burst reads; One bank active;

Address and control inputs changing once per clock cycle; tCK = tCK (min); IOUT = 0mA;

50% of data changing on every transfer.

IDD4R

Operating Current (burst write):

BL = 2; Continuous burst writes; One bank active;

Address and control inputs changing once per clock cycle; tCK = tCK (min);

DQ, DM, and DQS inputs changing twice per clock cycle; 50% of input data changing at every transfer.

IDD4W

Auto Refresh Current:

tRC = tRFC(min)

IDD5

Self Refresh Current:

CKE

≤ 0.2V; external clock on; tCK = tCK (min)

IDD6

1

Operating Current (Four bank operation):

Four-bank interleaving READs (burst = 4) with auto precharge; tRC = tRC (min); tCK = tCK (min);

Address and control inputs change only during ACTIVE, READ, or WRITE commands; IOUT = 0mA.

IDD7

2

Notes:

1. Enable on-chip refresh and address counters.

2. Random address is changing; 50% of data is changing at every transfer.

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