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Specifications subject to change without notice.

MNS Microwave Chip Capacitors

MA4M Series

V3.00

Bonding and Handling Considerations for

MNS Chip Capacitors

Handling

Normal precautions that are common to the handling of hybrid

semiconductors also apply to MNS chip capacitors. Removal of

chips from waffle packs and subsequent handling should be

done with a vacuum pencil. Pencils equipped with either metal-

lic or nonmetallic tips are acceptable.

Surface Preparation

Each MNS chip and substrate should be free of oils and other

surface contamination. Such contaminants may result in poor

solder wetting. Cleansing can be done with acetone, alcohol,

freon, TMS or other common microelectronic solvents. Bur-

nishing of MNS capacitor chips is not necessary or recom-

mended.

Solder

Soldering temperatures up to 300ºC are acceptable for a duration

not greater than 5 seconds for MNS chip capacitors. Any of the

common tin-lead-silver, lead-indium, or higher temperature gold

alloy solders are acceptable provided that the 300ºC temperature

is not exceeded.

Pure tin or tin-antimony solders are not

recommended. Cleaning of residual flux is required and can be

accomplished with a fluorinated or chlorinated solvent.

Conductive Epoxy

Any of the conductive epoxies that are available for semicon-

ductor die attachment are acceptable for MNS chip capacitor

attachment. Follow the manufacturer’s recommendations for

mixing and application carefully. Take care to seat the capacitor

on the substrate using a soft implement.

Lead Bonding

Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads

are all acceptable methods. Temperature for the pulse bonder

should not exceed 300ºC. Maximum pressure applied to the

MNS capacitor chips should not exceed 25 grams for any of the

methods used. Proper procedure will result in bond strength that

exceeds MIL-STD-883B Method 2011.2 for gold wire or gold

ribbon.