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LTC2206 Datasheet(PDF) 26 Page - Linear Technology |
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LTC2206 Datasheet(HTML) 26 Page - Linear Technology |
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26 / 32 page  LTC2207/LTC2206 26 22076fc Grounding and Bypassing The LTC2207/LTC2206 require a printed circuit board with a clean unbroken ground plane; a multilayer board with an internal ground plane is recommended. The pinout of the LTC2207/LTC2206 has been optimized for a flowthrough layout so that the interaction between inputs and digital outputs is minimized. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, VCM, and OVDD pins. Bypass capacitors must be located as close to the pins as possible. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2207/LTC2206 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Heat Transfer Most of the heat generated by the LTC2207/LTC2206 is transferred from the die through the bottom-side exposed pad. For good electrical and thermal performance, the exposed pad must be soldered to a large grounded pad on the PC board. It is critical that the exposed pad and all ground pins are connected to a ground plane of sufficient area with as many vias as possible. APPLICATIONS INFORMATION |
Similar Part No. - LTC2206_15 |
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Similar Description - LTC2206_15 |
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