DICE SPECIFICATION

2

RH1078M

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

LINEAR TECHNOLOGY CORPORATION 2005

LT 0314 REV B • PRINTED IN USA

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information

on dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

I.D.No. 66-13-1078

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: Power supply rejection ratio is measured at the minimum supply

voltage.

SYMBOL

PARAMETER

CONDITIONS

MIN

MAX

UNITS

Large-Signal Voltage Gain

150

120

V/mV

V/mV

V/mV

V/mV

Output Voltage Swing

Output Low, No Load

Output Low, 2k to GND

Output High, No Load

Output High, 2k to GND

4.2

3.5

6

2

130

mV

mV

mV

V

V

SR

Slew Rate

0.04

V/μs

Supply Current

Per Amplifier

75

μA

Minimum Supply Voltage

Note 2

2.3

V

SYMBOL

PARAMETER

CONDITIONS

MIN

MAX

UNITS

Input Offset Voltage

350

μV

Input Offset Current

0.8

nA

Input Bias Current

15

nA

Input Voltage Range

13.5

–15.0

V

V

CMRR

Common Mode Rejection Ratio

97

dB

dB

PSRR

Power Supply Rejection Ratio

100

dB

Large-Signal Voltage Gain

1000

300

V/mV

V/mV

V/mV

Output Voltage Swing

RL = 50k

RL = 2k

RL = 5k

±13

±11

V

V

V

SR

Slew Rate

0.06

V/μs

Supply Current

Per Amplifier

100

μA