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2SJ555 Datasheet(PDF) 7 Page - Renesas Technology Corp |
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2SJ555 Datasheet(HTML) 7 Page - Renesas Technology Corp |
7 / 10 page 2SJ555 Rev.3.00 Sep 07, 2005 page 5 of 7 Source to Drain Voltage VSD (V) Reverse Drain Current vs. Source to Drain Voltage 500 25 50 75 100 125 150 0 100 200 300 400 Channel Temperature Tch (°C) Maximum Avalanche Energy vs. Channel Temperature Derating IAP = –60 A VDD = –25 V duty < 0.1 % Rg ≥ 50 Ω –100 0 –20 –40 –60 –80 0 –0.4 –0.8 –1.2 –1.6 –2.0 Pulse Test –5 V VGS = 0 –10 V Avalanche Test Circuit Avalanche Waveform 0 ID VDS IAP V(BR)DSS VDD EAR = • L • IAP 2 • 2 1 VDSS VDSS – VDD D.U.T Rg IAP Monitor VDS Monitor VDD 50 Ω Vin –15 V L Pulse Width PW (S) Normalized Transient Thermal Impedance vs. Pulse Width 3 1 0.3 0.1 0.03 0.01 10 µ 100 µ 1 m 10 m 100 m 1 10 Tc = 25°C D = 1 0.5 0.2 0.1 0.05 0.02 0.01 1shot pul se PDM PW T D = PW T θch – c (t) = γ s (t) • θch – c θch – c = 1.0°C/W, Tc = 25°C |
Similar Part No. - 2SJ555_15 |
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Similar Description - 2SJ555_15 |
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