CDCL1810ARGZT datasheet(4/30 Pages) TI1

Part #	CDCL1810ARGZT

Description	Single 1.8 V Supply

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Manufacturer	TI1 [Texas Instruments]

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NC

AV

DD

CLKP

CLKN

AV

DD

YP0

YN0

V

DD

YP1

YN1

V

DD

V

SS

ADD0

V

DD

YN7

YP7

V

DD

YN6

YP6

V

DD

YN5

YP5

V

DD

SDA

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CDCL1810A

SLLSEL1 – NOVEMBER 2014

www.ti.com

7 Pin Configuration and Functions

48-Pin

RGZ Package

(Top View)

NOTE: Exposed thermal pad must be soldered to VSS.

The CDCL1810A is available in a 48-pin VQFN (RGZ) package with a pin pitch of 0,5mm. The exposed thermal

pad serves both thermal and electrical grounding purposes.

NOTE

The device must be soldered to ground (VSS) using as many ground vias as possible. The

device performance will be severely impacted if the exposed thermal pad is not grounded

appropriately.

4

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