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Die Characteristics

DIE DIMENSIONS:

(4166

µm x 6350µm x 483µm ±25.4µm)

164 x 250 x 19mils

±1mil

METALLIZATION:

Type: Silicon - Aluminum

Thickness: 13.0k

Å

SUBSTRATE POTENTIAL:

BACKSIDE FINISH:

Silicon

PASSIVATION:

Thickness: 8.0k

Å

WORST CASE CURRENT DENSITY:

PROCESS:

SSAJIIV-RH

Metallization Mask Layout

HS-6617RH-T

A2 (6)

A1 (7)

A0 (8)

(20) G

(19) A10

(18) E

HS-6617RH-T