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HMA510/883 Datasheet(PDF) 9 Page - Intersil Corporation |
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HMA510/883 Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 3-18 Die Characteristics DIE DIMENSIONS: 184 x 176 x 19 ± 1mils METALLIZATION: Type: Si - Al or Si-Al-Cu Thickness: 8k Å GLASSIVATION: Type: Nitrox Thickness: 10k Å WORST CASE CURRENT DENSITY: 0.9 x 105A/cm2 Metallization Mask Layout HMA510/883 HMA510/883 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com |
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