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OSR5XNE3E1E_VER.C.2 Datasheet(PDF) 2 Page - OptoSupply International |
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OSR5XNE3E1E_VER.C.2 Datasheet(HTML) 2 Page - OptoSupply International |
2 / 2 page ![]() X Xe eo on n 3 3 P Po ow we er r R Re ed d L LE ED D OSR5XNE3E1E VER C.2 ■ Soldering Heat Reliability (DIP): Reflow soldering Profile · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Solder Average ramp-up rate = 3ºC/sec. max. Preheat temperature: 150º~180ºC Preheat time = 120 sec. max. Ramp-down rate = 6ºC/sec. max. Peak temperature = 220ºC max. Time within 3ºC of actual peak temperature = 25 sec. max. Duration above 200ºC is 40 sec. max. LED & Application Technologies |
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