CD4070BMS datasheet(8/8 Pages) INTERSIL

Part #	CD4070BMS

Description	CMOS Quad Exclusive OR and Exclusive NOR Gates

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Manufacturer	INTERSIL [Intersil Corporation]

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7-462

CD4070BMS, CD4077BMS

FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A

FUNCTION OF SUPPLY VOLTAGE

FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A

FUNCTION OF INPUT FREQUENCY

Chip Dimensions and Pad Layout

CD4077BMSH

Dimensions and pad layout for CD4070BMSH are

identical

Dimensions in parenthesis are in millimeters and are

derived from the basic inch dimensions as indicated.

Grid graduations are in mils (10-3 inch).

METALLIZATION:

Thickness: 11k

Å

− 14kÅ, AL.

PASSIVATION:

10.4kÅ - 15.6k

Å, Silane

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches

Typical Performance Characteristics (Continued)

AMBIENT TEMPERATURE (TA) = +25

oC

LOAD CAPACITANCE (CL) = 50pF

200

100

300

0

5

10

15

20

SUPPLY VOLTAGE (VDD) (V)

10V

5V

10V

AMBIENT TEMPERATURE (TA) = +25

oC

CL = 15pF

CL = 50pF

SUPPLY VOLTAGE

(VDD) = 15V

8

6

4

28

6

4

22

INPUT FREQUENCY (fI) (kHz)

10-1

110102

103

8

6

4

28

6

42

8

6

4

104

6

4

2

102

10

1

10-1

6

4

2

6

4

2

103

6

4

2

104

6

4

2

105

6

4

2

LOAD CAPACITANCE

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Renesas Technology Corp	CD4070BMS	336Kb / 8P	CMOS Quad Exclusive OR and Exclusive NOR Gates December 1992

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CD4070BMS Datasheet(PDF) 8 Page - Intersil Corporation

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