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HPDL1414 Datasheet(PDF) 12 Page - Agilent(Hewlett-Packard) |
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HPDL1414 Datasheet(HTML) 12 Page - Agilent(Hewlett-Packard) |
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12 / 12 page  3-186 Soldering and Post Solder Cleaning Instructions The HPDL-1414/2416 may be hand soldered or wave soldered with SN63 solder. Hand soldering may be safely performed only with an electronically temperature-controlled and securely grounded soldering iron. For best results, the iron tip temperature should be set at 315 °C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be 245 °C ± 5°C (473°F ± 9°F), and the dwell in the wave should be set at 11/2 to 3 seconds for optimum soldering. Preheat temperature should not exceed 93 °C (200°F) as measured on the solder side of the PC board. For further information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Components. |
Similar Part No. - HPDL1414 |
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Similar Description - HPDL1414 |
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