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HFBR-5527 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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HFBR-5527 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
7 / 12 page ![]() 171 HFBR-5527 Transmitter Electrical/Optical Characteristics 0 to 70 °C, unless otherwise stated. Parameter Symbol Min. Typ.[2] Max. Unit Condition Note Transmitter Output Optical PT -9.5 -7.0 -4.8 dBm IF,dc = 30 mA, 25°C Note 3 Power, 1 mm POF -10.4 -4.3 0-70 °C Transmitter Output Optical PT -13.0 -10.5 dBm IF,dc = 60 mA, 25°C Note 3 Power, 200 µm HCS® -10.0 0-70 °C Output Optical Power ∆P T -0.02 dB/ °C Temperature Coefficient ∆T Peak Emission Wavelength λ PK 640 650 660 nm Peak Wavelength ∆λ 0.12 nm/ °C Temperature Coefficient ∆T Spectral Width FWHM 21 nm Full Width, Half Maximum Forward Voltage VF 1.8 2.0 2.4 V IF = 60 mA Forward Voltage ∆V F -1.8 mV/ °C Temperature Coefficient ∆T Transmitter Numerical NA 0.5 Aperture Thermal Resistance, θ jc 140 °C/W Note 4 Junction to Case Reverse Input Breakdown VBR 3.0 13 V IF,dc = -10 µA Voltage Diode Capacitance CO 60 pF VF = 0 V, f = 1 MHz Unpeaked Optical Rise tr 12 ns IF = 60 mA Figure 5 Time, 10% - 90% f = 100 kHz Note 5 Unpeaked Optical Fall tf 9ns IF = 60 mA Figure 5 Time, 90% - 10% f = 100 kHz Note 5 Notes: 1. 1.6 mm below seating plane. 2. Typical data is at 25 °C. 3. Optical Power measured at the end of 0.5 meter of 1 mm diameter plastic or 200 µm diameter hard clad silica optical fiber with a large area detector. 4. Typical value measured from junction to PC board solder joint. 5. Optical rise and fall times can be reduced with the appropriate driver circuit. 6. Pins 9 and 10 are primarily for mounting and retaining purposes, but are electrically connected with conductive housing; pins 5 and 6 are electrically unconnected. It is recommended that pins 5, 6, 9, and 10 all be connected to Rx ground to reduce coupling of electrical noise. 7. Refer to the Versatile Link Family Fiber Optic Cable and Connectors Technical Data Sheet for cable connector options for 1 mm plastic optical fiber and 200 µm HCS fiber. 8. The LED current peaking necessary for high frequency circuit design contributes to electromagnetic interference (EMI). Care must be taken in circuit board layout to minimize emissions for compliance with governmental EMI emissions regulations. |
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