Pre-Production

WM7121P, WM7121PE

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PP, June 2014, Rev 3.0

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PCB LAND PATTERN AND PASTE STENCIL

The recommended PCB Land Pattern and Paste Stencil Pattern for the WM7121P microphone are

shown in Figure 4 and Figure 5.

See also Application Note WAN0284 (General Design Considerations for MEMS Microphones) for

further details of PCB footprint design.

Full definition of the package dimensions is provided in the “Package Dimensions” section.

Figure 4 DM124 - PCB Land Pattern, Top View

Figure 5 DM124 - Paste Stenctil Pattern, Top View