CYStech Electronics Corp.

Spec. No. : C546P8

Issued Date : 2013.03.14

Revised Date :

Page No. : 7/7

LM358P8

CYStek Product Specification

DIP-8 Dimension

DIP-8 Plastic Package

CYStek Package Code : P8

Marking:

Device

Name

LM358

□□□□

Date

Code

Millimeters

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

3.710

4.310

0.146

0.170

D

9.000

9.400

0.354

0.370

A1

0.510

-

0.020

-

E

6.200

6.600

0.244

0.260

A2

3.200

3.600

0.126

0.142

E1

7.320

7.920

0.288

0.312

B

0.380

0.570

0.015

0.022

e

2.540 (BSC)

0.100 (BSC)

B1

1.524 (BSC)

0.060 (BSC)

L

3.000

3.600

0.118

0.142

C

0.204

0.360

0.008

0.014

E2

8.400

9.000

0.331

0.354

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.