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DS1245W Datasheet(PDF) 10 Page - Dallas Semiconductor |
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DS1245W Datasheet(HTML) 10 Page - Dallas Semiconductor |
10 / 11 page DS1245W 10 of 11 DS1245W NONVOLATILE SRAM, 34-PIN POWERCAP MODULE WITH POWERCAP INCHES PKG DIM MIN NOM MAX A 0.920 0.925 0.930 B 0.955 0.960 0.965 C 0.240 0.245 0.250 D 0.052 0.055 0.058 E 0.048 0.050 0.052 F 0.015 0.020 0.025 G 0.020 0.025 0.030 ASSEMBLY AND USE Reflow soldering Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder reflow oriented label-side up (live-bug). Hand soldering and touch-up Do not touch soldering iron to leads for more than 3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove part, apply flux, heat pad until solder reflows, and use a solder wick. LPM replacement in a socket To replace a Low Profile Module in a 68-pin PLCC socket, attach a DS9034PC PowerCap to a module base then insert the complete module into the socket one row of leads at a time, pushing only on the corners of the cap. Never apply force to the center of the device. To remove from a socket, use a PLCC extraction tool and ensure that it does not hit or damage any of the module IC components. Do not use any other tool for extraction. |
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