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BD4275FP2-C Datasheet(PDF) 11 Page - Rohm |
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BD4275FP2-C Datasheet(HTML) 11 Page - Rohm |
11 / 23 page ![]() 11/20 29.Nov.2013 Rev.003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD4275FP2-C BD4275FPJ-C Datasheet TSZ02201-0T2T0AN00110-1-2 Power Dissipation ■TO263-5F IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size: 114.3 mm × 76.2 mm × 1.6 mmt (with thermal via on the board) Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm) ②: 2-layer PCB (Copper foil area on the reverse side of PCB: 15.0mm × 15.0 mm) ③: 2-layer PCB (Copper foil area on the reverse side of PCB: 74.2mm × 74.2 mm) ④: 4-layer PCB (2inner layers and copper foil area on the reverse side of PCB: 74.2mm × 74.2 mm) ■TO252-J5F IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size: 114.3 mm × 76.2 mm × 1.6 mmt (with thermal via on the board) Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm) ②: 2-layer PCB (Copper foil area on the reverse side of PCB: 15.0mm × 15.0 mm) ③: 2-layer PCB (Copper foil area on the reverse side of PCB: 74.2mm × 74.2 mm) ④: 4-layer PCB (2 inner layers and copper foil area on the reverse side of PCB: 74.2mm × 74.2 mm) Figure 21. Package data of TO263-5F Figure 22. Package data of TO252-J5F ②1.8 W ①1.3 W ③4.1 W ④6.5 W 0 2 4 6 8 10 0 255075 100 125 150 Ambient Temperature: Ta [°C] 0 2 4 6 8 10 0 255075 100 125 150 Ambient Temperture: Ta[˚C] ④8.0W ③5.0W ②2.3W ①1.9W |
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