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EG80C186EC25 Datasheet(PDF) 25 Page - Intel Corporation |
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EG80C186EC25 Datasheet(HTML) 25 Page - Intel Corporation |
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25 / 57 page  80C186EC188EC 80L186EC188EC ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Storage Temperature b 65 Cto a150 C Case Temperature Under Bias b 65 Cto a100 C Supply Voltage with Respect to VSS b 05V to a65V Voltage on Other Pins with Respect to VSS b 05V to VCC a 05V NOTICE This data sheet contains preliminary infor- mation on new products in production The specifica- tions are subject to change without notice Verify with your local Intel Sales office that you have the latest data sheet before finalizing a design WARNING Stressing the device beyond the ‘‘Absolute Maximum Ratings’’ may cause permanent damage These are stress ratings only Operation beyond the ‘‘Operating Conditions’’ is not recommended and ex- tended exposure beyond the ‘‘Operating Conditions’’ may affect device reliability Recommended Connections Power and ground connections must be made to multiple VCC and VSS pins Every 80C186EC-based circuit board should include separate power (VCC) and ground (VSS) planes Every VCC pin must be connected to the power plane and every VSS pin must be connected to the ground plane Liberal de- coupling capacitance should be placed near the processor The processor can cause transient pow- er surges when its output buffers transition particu- larly when connected to large capacitive loads Low inductance capacitors and interconnects are recommended for best high frequency electrical per- formance Inductance is reduced by placing the de- coupling capacitors as close as possible to the proc- essor VCC and VSS package pins Always connect any unused input to an appropriate signal level In particular unused interrupt inputs (NMI INT07) should be connected to VSS through a pull-down resistor Leave any unused output pin un- connected 25 |
Similar Part No. - EG80C186EC25 |
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Similar Description - EG80C186EC25 |
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