16

AT24C01A/02/04/08A/16A

0180V–SEEPR–8/05

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Ordering Code

Package

Operation Range

AT24C08A-10PI-2.7

AT24C08AN-10SI-2.7

AT24C08A-10TI-2.7

8P3

8S1

8A2

Industrial Temperature

(–40

°C to 85°C)

AT24C08A-10PI-1.8

AT24C08AN-10SI-1.8

AT24C08A-10TI-1.8

8P3

8S1

8A2

Industrial Temperature

(–40

°C to 85°C)

8P3

8P3

8S1

8S1

8A2

8A2

8Y1

8Y5

8U2-1

Lead-free/Halogen-free/

Industrial Temperature

(

−40°C to 85°C)

Die Sale

Die Sale

Industrial Temperature

(

−40°C to 85°C)

Package Type

8P3

8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8Y5

8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-Leaded, Miniature Array Package (MAP)

8U2-1

8-ball, die Ball Grid Array Package (dBGA2)

Options

−2.7

Low Voltage (2.7V to 5.5V)

−1.8

Low Voltage (1.8V to 5.5V)