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K2502S70RP Datasheet(PDF) 6 Page - Littelfuse |
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K2502S70RP Datasheet(HTML) 6 Page - Littelfuse |
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6 / 12 page  6 Revised: December 9, 2011 01:32 PM ©2011 Littelfuse, Inc Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Standard Bidirectional SIDACs Kxxxzy Series Soldering Parameters Reflow Condition Pb – Free assembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (min to max) (t s) 60 – 180 secs Average ramp up rate (LiquidusTemp) (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds PeakTemperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peakTemperature (T P) 8 minutes Max. Do not exceed 280°C Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do Physical Specifications Reliability/Environmental Tests Test Specifications and Conditions High Temperature Voltage Blocking MIL-STD-750: Method 1040, Condition A Rated V DRM (VAC-peak), 125°C, 1008 hours Temperature Cycling MIL-STD-750: Method 1051 -40°C to 150°C, 15-minute dwell, 100 cycles Biased Temperature & Humidity EIA/JEDEC: JESD22-A101 80% min V BO (VDC), 85°C, 85%RH, 1008 hours High Temp Storage MIL-STD-750: Method 1031 150°C, 1008 hours Low-Temp Storage -40°C, 1008 hours Thermal Shock MIL-STD-750: Method 1056 0°C to 100°C, 5-minute dwell, 10-second transfer, 10 cycles Autoclave (Pressure Cooker Test) EIA/JEDEC: JESD22-A102 121°C, 100%RH, 2atm, 168 hours Resistance to Solder Heat MIL-STD-750: Method 2031 260°C, 10 seconds Solderability ANSI/J-STD-002: Category 3 Lead Bend MIL-STD-750: Method 2036, Condition E Terminal Finish 100% Matte Tin Plated / Pb-free Solder Dipped Body Material UL recognized epoxy meeting flammability classification 94V-0 Lead Material Copper Alloy Design Considerations Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Overheating and surge currents are the main killers of SIDACs. Correct mounting, soldering, and forming of the leads also help protect against component damage. |
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