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LMH0387SL Datasheet(PDF) 14 Page - Texas Instruments |
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LMH0387SL Datasheet(HTML) 14 Page - Texas Instruments |
14 / 23 page 0 50 100 150 200 250 300 350 400 BELDEN 1694A CABLE LENGTH (m) 0 5 10 15 20 25 30 LMH0387 SNLS315G – APRIL 2010 – REVISED APRIL 2013 www.ti.com Figure 5. CLI vs. Belden 1694A Cable Length OUTPUT MODE (CABLE DRIVER) DESCRIPTION INPUT INTERFACING The LMH0387 cable driver accepts differential input signals which can be DC or AC coupled. OUTPUT INTERFACING The LMH0387 cable driver uses 75 Ω internally terminated current mode outputs. The output level is 800 mVP-P with an RREF resistor of 715Ω. The RREF resistor is connected between the RREF pin and VCC, and should be placed as close as possible to the RREF pin. The output should be AC coupled as shown in the Typical Application Circuit diagram. The TERMTX output must be properly terminated with a 4.7 µF capacitor followed by a 75 Ω resistor to ground as shown. OUTPUT SLEW RATE CONTROL The LMH0387 cable driver output rise and fall times are selectable for either SMPTE 259M or SMPTE 424M / 292M compliance via the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise and fall times, or SMPTE 424M and SMPTE 292M compliance, SD/HD is set low. SD/HD has an internal pulldown. OUTPUT ENABLE The LMH0387 cable driver can be enabled or disabled with the TX_EN pin. When set low, the cable driver is powered off. TX_EN has an internal pullup to enable the cable driver by default. When using the LMH0387 in the input mode (as an equalizer), the cable driver must be disabled by setting the TX_EN pin low. APPLICATION INFORMATION PCB LAYOUT RECOMMENDATIONS For information on layout and soldering of the laminate TLGA package, pease refer to the following application note: AN-1125 (SNAA002), “Laminate CSP/FBGA.” For a CSP package, it is a general requirement not to have any metal (traces or vias) on the top layer in the area directly underneath the device, other than the footprint. This is intended to provide a flat planar surface for the package. 14 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMH0387 |
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