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12101C474KAT2A Datasheet(PDF) 98 Page - AVX Corporation |
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12101C474KAT2A Datasheet(HTML) 98 Page - AVX Corporation |
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98 / 99 page  97 Surface Mounting Guide MLC Chip Capacitors PCB BOARD DESIGN To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is located. Solder Tip Solder Tip Preferred Method - No Direct Part Contact Poor Method - Direct Contact with Part No Stress Relief for MLCs Routed Cut Line Relieves Stress on MLC COMMON CAUSES OF MECHANICAL CRACKING The most common source for mechanical stress is board depanelization equipment, such as manual breakapart, v- cutters and shear presses. Improperly aligned or dull cutters may cause torqueing of the PCB resulting in flex stresses being transmitted to components near the board edge. Another common source of flexural stress is contact during parametric testing when test points are probed. If the PCB is allowed to flex during the test cycle, nearby ceramic capacitors may be broken. A third common source is board to board connections at vertical connectors where cables or other PCBs are connected to the PCB. If the board is not supported during the plug/unplug cycle, it may flex and cause damage to nearby components. Special care should also be taken when handling large (>6" on a side) PCBs since they more easily flex or warp than smaller boards. REWORKING OF MLCs Thermal shock is common in MLCs that are manually attached or reworked with a soldering iron. AVX strongly recommends that any reworking of MLCs be done with hot air reflow rather than soldering irons. It is practically impossible to cause any thermal shock in ceramic capacitors when using hot air reflow. However direct contact by the soldering iron tip often causes thermal cracks that may fail at a later date. If rework by soldering iron is absolutely necessary, it is recommended that the wattage of the iron be less than 30 watts and the tip temperature be <300ºC. Rework should be performed by applying the solder iron tip to the pad and not directly contacting any part of the ceramic capacitor. |
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Similar Description - 12101C474KAT2A |
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