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12101C474KAT2A Datasheet(PDF) 95 Page - AVX Corporation |
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12101C474KAT2A Datasheet(HTML) 95 Page - AVX Corporation |
95 / 99 page ![]() 94 Surface Mounting Guide Recommended Soldering Profiles Recommended Reflow Profiles Time / secs 25 50 75 100 125 150 175 200 225 250 275 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420 Pb Free Recommended Pb Free Max with care Sn Pb Recommended REFLOW SOLDER PROFILES AVX RoHS compliant products utilize termination finishes (e.g.Sn or SnAg) that are compatible with all Pb-Free soldering systems and are fully reverse compatible with SnPb soldering systems. A recommended SnPb profile is shown for comparison; for Pb-Free soldering, IPC/JEDECJ- STD-020C may be referenced. The upper line in the chart shows the maximum envelope to which products are qualified (typically 3x reflow cycles at 260ºC max). The center line gives the recommended profile for optimum wettability and soldering in Pb-Free Systems. 25 75 125 175 225 275 0 50 100 150 200 250 300 350 400 Preheat Reflow Cool Down Preheat Preheat Wave Wave Cool Down Cool Down Time / seconds Recommended Soldering Profiles WAVE SOLDER PROFILES For wave solder, there is no change in the recommended wave profile; all standard Pb-Free (SnCu/SnCuAg) systems operate at the same 260ºC max recommended for SnPb systems. Preheat: This is more important for wave solder; a higher temperature preheat will reduce the thermal shock to SMD parts that are immersed (please consult individual product data sheets for SMD parts that are suited to wave solder). SMD parts should ideally be heated from the bottom-Side prior to wave. PTH (Pin through hole) parts on the topside should not be separately heated. Wave: 250ºC – 260ºC recommended for optimum solderability. Cool Down: As with reflow solder, cool down should not be forced and 6ºC/sec is recommended. Any air knives at the end of the 2nd wave should be heated. Preheat: The pre-heat stabilizes the part and reduces the temperature differential prior to reflow. The initial ramp to 125ºC may be rapid, but from that point (2-3)ºC/sec is recommended to allow ceramic parts to heat uniformly and plastic encapsulated parts to stabilize through the glass transition temperature of the body (~ 180ºC). Reflow: In the reflow phase, the maximum recommended time > 230ºC is 40secs. Time at peak reflow is 10secs max.; optimum reflow is achieved at 250ºC, (see wetting balance chart opposite) but products are qualified to 260ºC max. Please reference individual product datasheets for maximum limits Cool Down: Cool down should not be forced and 6ºC/sec is recommended. A slow cool down will result in a finer grain structure of the reflow solder in the solder fillet. IMPORTANT NOTE: Typical Pb-Free reflow solders have a more dull and grainy appearance compared to traditional SnPb. Elevating the reflow temperature will not change this, but extending the cool down can help improve the visual appearance of the joint. -0.40 -0.30 -0.20 -0.10 0.00 0.10 0.20 0.30 0.40 200 210 220 230 240 250 260 270 Temperature of Solder [C] SnPb - Sn60Pb40 Sn - Sn60Pb40 Sn-Sn3.5Ag0.7Cu Sn-Sn2.5Ag1Bi0.5Cu Sn-Sn0.7Cu Preheat Reflow Cool Down Preheat Wave Cool Down Wetting Force at 2nd Sec. (higher is better) |
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