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12101C474KAT2A Datasheet(PDF) 95 Page - AVX Corporation

Part # 12101C474KAT2A
Description  AVX Surface Mount Ceramic Capacitor Products
Download  99 Pages
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Manufacturer  AVX [AVX Corporation]
Direct Link  http://www.avx.com
Logo AVX - AVX Corporation

12101C474KAT2A Datasheet(HTML) 95 Page - AVX Corporation

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94
Surface Mounting Guide
Recommended Soldering Profiles
Recommended Reflow Profiles
Time / secs
25
50
75
100
125
150
175
200
225
250
275
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
320
340
360
380
400
420
Pb Free Recommended
Pb Free Max with care
Sn Pb Recommended
REFLOW SOLDER PROFILES
AVX RoHS compliant products utilize termination
finishes (e.g.Sn or SnAg) that are compatible
with all Pb-Free soldering systems and are fully
reverse compatible with SnPb soldering systems.
A recommended SnPb profile is shown for
comparison; for Pb-Free soldering, IPC/JEDECJ-
STD-020C may be referenced. The upper line in
the chart shows the maximum envelope to which
products are qualified (typically 3x reflow cycles
at
260ºC max). The center line gives the
recommended profile for optimum wettability and
soldering in Pb-Free Systems.
25
75
125
175
225
275
0
50
100
150
200
250
300
350
400
Preheat
Reflow
Cool Down
Preheat
Preheat
Wave
Wave
Cool Down
Cool Down
Time / seconds
Recommended Soldering Profiles
WAVE SOLDER PROFILES
For wave solder, there is no change in the recommended
wave profile; all standard Pb-Free (SnCu/SnCuAg) systems
operate at the same 260ºC max recommended for SnPb
systems.
Preheat:
This is more important for wave solder; a higher
temperature preheat will reduce the thermal shock to SMD
parts that are immersed (please consult individual product
data sheets for SMD parts that are suited to wave solder).
SMD parts should ideally be heated from the bottom-Side
prior to wave. PTH (Pin through hole) parts on the topside
should not be separately heated.
Wave:
250ºC – 260ºC recommended for optimum solderability.
Cool Down:
As with reflow solder, cool down should not be forced and
6ºC/sec is recommended. Any air knives at the end of the
2nd wave should be heated.
Preheat:
The pre-heat stabilizes the part and reduces the
temperature differential prior to reflow. The initial ramp to
125ºC may be rapid, but from that point (2-3)ºC/sec is
recommended to allow ceramic parts to heat uniformly and
plastic encapsulated parts to stabilize through the glass
transition temperature of the body (~ 180ºC).
Reflow:
In the reflow phase, the maximum recommended time
> 230ºC is 40secs. Time at peak reflow is 10secs max.;
optimum reflow is achieved at 250ºC, (see wetting balance
chart opposite) but products are qualified to 260ºC max.
Please reference individual product datasheets for
maximum limits
Cool Down:
Cool down should not be forced and 6ºC/sec is
recommended. A slow cool down will result in a finer grain
structure of the reflow solder in the solder fillet.
IMPORTANT NOTE: Typical Pb-Free reflow solders have a
more dull and grainy appearance compared to traditional
SnPb. Elevating the reflow temperature will not change this,
but extending the cool down can help improve the visual
appearance of the joint.
-0.40
-0.30
-0.20
-0.10
0.00
0.10
0.20
0.30
0.40
200
210
220
230
240
250
260
270
Temperature of Solder [C]
SnPb - Sn60Pb40
Sn - Sn60Pb40
Sn-Sn3.5Ag0.7Cu
Sn-Sn2.5Ag1Bi0.5Cu
Sn-Sn0.7Cu
Preheat
Reflow
Cool Down
Preheat
Wave
Cool Down
Wetting Force at 2nd Sec. (higher is better)


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