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12101C474KAT2A Datasheet(PDF) 66 Page - AVX Corporation |
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12101C474KAT2A Datasheet(HTML) 66 Page - AVX Corporation |
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66 / 99 page  65 GENERAL DESCRIPTION Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. IDCs are typically used on packages of semiconductor products with power levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and ASSP devices produced on 0.13µ, 90nm, 65nm, and 45nm processes. IDC devices are used on both ceramic and organic package substrates. These low ESL surface mount capacitors can be placed on the bottom side or the top side of a package substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of packages under a heat spreader. IDCs are used for board level decoupling of systems with speeds of 300MHz or greater. Low ESL IDCs free up valuable board space by reducing the number of capacitors required versus standard MLCCs. There are additional benefits to reducing the number of capacitors beyond saving board space including higher reliability from a reduction in the number of components and lower placement costs based on the need for fewer capacitors. The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is the second family of Low Inductance MLCC products created by AVX. IDCs are a cost effective alternative to AVX’s first generation low ESL family for high-reliability applications known as LICA (Low Inductance Chip Array). AVX IDC products are available with a lead-free finish of plated Nickel/Tin. HOW TO ORDER + – + – 0.001 1 10 100 1000 Frequency (MHz) 0.01 0.1 1 10 LICC_0612 IDC_0612 MLCC_1206 PERFORMANCE CHARACTERISTICS Capacitance Tolerance ±20% Preferred Operation X7R = -55°C to +125°C Temperature Range X5R = -55°C to +85°C X7S = -55°C to +125°C Temperature Coefficient ±15% (0VDC) Voltage Ratings 4, 6.3, 10, 16 VDC Dissipation Factor 4V, 6.3V = 6.5% max; 10V = 5.0% max; 16V = 3.5% max Insulation Resistance 100,000M Ω min, or 1,000MΩ per (@+25°C, RVDC) µF min.,whichever is less Dielectric Strength No problems observed after 2.5 x RVDC for 5 seconds at 50mA max current CTE (ppm/C) 12.0 Thermal Conductivity 4-5W/M K Terminations Plated Nickel and Solder Available Max. Thickness 0.037" (0.95mm) W Style 3 IDC Case Size 2 = 0508 3 = 0612 L Low Inductance 1 Number of Terminals 1 = 8 Terminals 6 Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V D Dielectric C = X7R D = X5R Z = X7S 225 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance M = ±20% T Termination T = Plated Ni and Sn 3 Packaging Available 1=7" Reel 3=13" Reel A Thickness Max. Thickness mm (in.) A=0.95 (0.037) S=0.55 (0.022) A Failure Rate A = N/A 0612 0508 IDC Low Inductance Capacitors (RoHS) 0612/0508 IDC (InterDigitated Capacitors) NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. TYPICAL IMPEDANCE |
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