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MCP1640T-IMC Datasheet(PDF) 4 Page - Microchip Technology |
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MCP1640T-IMC Datasheet(HTML) 4 Page - Microchip Technology |
4 / 32 page MCP1640/B/C/D DS22234A-page 4 2010 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS NMOS Peak Switch Current Limit IN(MAX) 600 850 — mA Note 5 VOUT Accuracy VOUT% -3 — +3 % Includes Line and Load Regulation; VIN = 1.5V Line Regulation V OUT/ VOUT) / V IN| -1 0.01 1 %/V VIN = 1.5V to 3V IOUT = 25 mA Load Regulation V OUT / VOUT| -1 0.01 1 %IOUT = 25 mA to 100 mA; VIN = 1.5V Maximum Duty Cycle DCMAX 88 90 — % Switching Frequency fSW 425 500 575 kHz EN Input Logic High VIH 90 —— %of VIN IOUT = 1 mA EN Input Logic Low VIL —— 20 %of VIN IOUT = 1 mA EN Input Leakage Current IENLK — 0.005 — µA VEN = 5V Soft-start Time tSS — 750 — µS EN Low to High, 90% of VOUT; Note 4 Thermal Shutdown Die Temperature TSD — 150 — C Die Temperature Hysteresis TSDHYS — 10 — C Electrical Specifications: Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Junction Temperature Range TJ -40 — +125 °C Steady State Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Transient Package Thermal Resistances Thermal Resistance, 5L-TSOT23 JA — 192 — °C/W EIA/JESD51-3 Standard Thermal Resistance, 8L-2x3 DFN JA —93 — °C/W DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT =3.3V, IOUT =15 mA, TA = +25°C. Boldface specifications apply over the TA range of -40 oC to +85oC. Parameters Sym Min Typ Max Units Conditions Note 1: 3.3 K resistive load, 3.3V OUT (1 mA). 2: For VIN > VOUT, VOUT will not remain in regulation. 3: IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)). 4: 220 resistive load, 3.3V OUT (15 mA). 5: Peak current limit determined by characterization, not production tested. |
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