 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
MP2483 Datasheet(PDF) 2 Page - Monolithic Power Systems |
|
||||||||||||||||||||||||||||||
MP2483 Datasheet(HTML) 2 Page - Monolithic Power Systems |
|
|
2 / 14 page  MP2483 – 2.5A, 55V, PROGRAMABLE FREQUENCY WHITE LED DRIVER MP2483 Rev. 1.0 www.MonolithicPower.com 2 12/25/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) MP2483DQ 3x3 QFN10 9M -40 °C to +85°C MP2483DS SOIC14 MP2483DS -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP2483DQ–Z). For RoHS compliant packaging, add suffix –LF (e.g. MP2483DQ–LF–Z) PACKAGE REFERENCE TOP VIEW VDD VSS OVP FB COMP 1 2 3 4 5 SW BST INGND EN/DIM RSET 10 9 8 7 6 NC VDD VSS OVP FB COMP NC NC SW BST INGND EN/DIM REST NC 1 2 3 4 14 13 12 11 10 9 8 5 6 7 TOP VIEW QFN10 SOIC14 ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VDD – VSS.............................60V VSW – VSS .................................... -0.3V to 60.3V VBST .................................................... VSW + 6V VEN/Dim – VINGND............................... -0.3V to +6V VINGND – VSS ................................... -0.3V to 60V Other pins – VSS............................. -0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) 3x3 QFN10 ................................................2.5W SOIC14......................................................1.4W Junction Temperature.............................. 150 °C Lead Temperature ................................... 260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VDD – VSS................ 4.5V to 55V Operating Junct. Temp (TJ)...... -40°C to +125°C Thermal Resistance (4) θJA θJC 3x3 QFN10 .............................50 ...... 12 ... °C/W SOIC14...................................86 ...... 38 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device function is not guaranteed outside of the recommended operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
Similar Part No. - MP2483 |
|
Similar Description - MP2483 |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
