DAC8532

2

SBAS246A

www.ti.com

SPECIFICATION

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

DAC8532

MSOP-8

DGK

–40

°C to +105°C

D32E

DAC8532IDGK

Tube, 80

""

"

"

DAC8532IDGKR

Tape and Reel,

2500

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Resolution

16

Bits

Relative Accuracy

±0.0987

% of FSR

Differential Nonlinearity

16-Bit Monotonic

±1LSB

Zero-Scale Error

+5

+25

mV

Full-Scale Error

–0.15

–1.0

% of FSR

Gain Error

±1.0

% of FSR

Zero-Scale Error Drift

±20

µV/°C

Gain Temperature Coefficient

±5

ppm of FSR/

°C

Channel-to-Channel Matching

15

mV

PSRR

0.75

mV/V

Output Voltage Range

V

Output Voltage Settling Time

To

±0.003% FSR

810

µs

12

µs

Slew Rate

1V/

µs

Capacitive Load Stability

470

pF

1000

pF

Code Change Glitch Impulse

1LSB Change Around Major Carry

20

nV-s

Digital Feedthrough

0.5

nV-s

DC Crosstalk

0.25

LSB

AC Crosstalk

–100

–96

dB

DC Output Impedance

1

Ω

Short-Circuit Current

50

mA

20

mA

Power-Up Time

Coming Out of Power-Down Mode

2.5

µs

Coming Out of Power-Down Mode

5

µs

AC PERFORMANCE

SNR

94

dB

THD

67

dB

SFDR

69

dB

SINAD

65

dB

Operating Temperature Range ...................................... –40

°C to +105°C

Storage Temperature Range ......................................... –65

°C to +150°C

θ

θ

Lead Temperature, Soldering:

Vapor Phase (60s) ............................................................... +215

°C

Infrared (15s) ........................................................................ +220

°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PACKAGE/ORDERING INFORMATION

ELECTRICAL CHARACTERISTICS

V

DAC8532