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CC1206JRNPOBBN100 Datasheet(PDF) 13 Page - YAGEO Corporation |
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CC1206JRNPOBBN100 Datasheet(HTML) 13 Page - YAGEO Corporation |
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13 / 15 page  www.yageo.com Aug 05, 2011 V8 Surface-Mount Ceramic Multilayer Capacitors 13 15 Product specification General Purpose 16 V to 50 V NP0 TEST TEST METHOD PROCEDURE REQUIREMENTS Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned <General purpose series> ∆C/C Class 1: NP0: within ±0.5% or 0.5 pF whichever is greater Resistance to soldering heat IEC 60384- 21/22 4.9 Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ±1 hours at room temperature Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ±5 °C Dipping time: 10 ±0.5 seconds Recovery time: 24 ±2 hours D.F. within initial specified value Rins within initial specified value Solderability 4.10 Preheated the temperature of 80 °C to 140 °C and maintained for 30 seconds to 60 seconds. Test conditions for lead containing solder alloy Temperature: 235 ±5 °C Dipping time: 2 ±0.2 seconds Depth of immersion: 10 mm Alloy Composition: 60/40 Sn/Pb Number of immersions: 1 Test conditions for lead-free containing solder alloy Temperature: 245 ±5 °C Dipping time: 3 ±0.3 seconds Depth of immersion: 10 mm Alloy Composition: SAC305 Number of immersions: 1 The solder should cover over 95% of the critical area of each termination No visual damage <General purpose series> ∆C/C Class 1: NP0: within ±1% or 1 pF whichever is greater Rapid change of temperature 4.11 Preconditioning; 150 +0/–10 °C for 1 hour, then keep for 24 ±1 hours at room temperature 5 cycles with following detail: 30 minutes at lower category temperature 30 minutes at upper category temperature Recovery time 24 ±2 hours D.F. meet initial specified value Rins meet initial specified value |
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