ICM7555_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 3 August 2009

19 of 22

NXP Semiconductors

ICM7555

General purpose CMOS timer

14.4 Package related soldering information

[1]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2]

For PMFP packages hot bar soldering or manual soldering is suitable.

15. Abbreviations

Table 8.

Suitability of through-hole mount IC packages for dipping and wave soldering

Package

Soldering method

Dipping

Wave

CPGA, HCPGA

-

suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable

-

not suitable

Table 9.

Abbreviations

Acronym

Description

CMOS

Complementary Metal-Oxide Semiconductors

TTL

Transistor-Transistor Logic

SCR

Silicon-Controlled Rectifier