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LM2675M-3.3 Datasheet(PDF) 26 Page - Texas Instruments |
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LM2675M-3.3 Datasheet(HTML) 26 Page - Texas Instruments |
26 / 30 page *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2675LD-5.0 WSON NHN 16 1000 210.0 185.0 35.0 LM2675LD-5.0/NOPB WSON NHN 16 1000 213.0 191.0 55.0 LM2675LD-ADJ WSON NHN 16 1000 210.0 185.0 35.0 LM2675LD-ADJ/NOPB WSON NHN 16 1000 213.0 191.0 55.0 LM2675LDX-ADJ/NOPB WSON NHN 16 4500 367.0 367.0 35.0 LM2675MX-12 SOIC D 8 2500 367.0 367.0 35.0 LM2675MX-12/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2675MX-3.3 SOIC D 8 2500 367.0 367.0 35.0 LM2675MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2675MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2675MX-ADJ SOIC D 8 2500 367.0 367.0 35.0 LM2675MX-ADJ/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2 |
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