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LM2675M-3.3 Datasheet(PDF) 25 Page - Texas Instruments |
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LM2675M-3.3 Datasheet(HTML) 25 Page - Texas Instruments |
25 / 30 page TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant LM2675LD-5.0 WSON NHN 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 LM2675LD-5.0/NOPB WSON NHN 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 LM2675LD-ADJ WSON NHN 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 LM2675LD-ADJ/NOPB WSON NHN 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 LM2675LDX-ADJ/NOPB WSON NHN 16 4500 330.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 LM2675MX-12 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2675MX-12/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2675MX-3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2675MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2675MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2675MX-ADJ SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2675MX-ADJ/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1 |
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