LM2675

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SNVS129E – MAY 2004 – REVISED JUNE 2005

When using the adjustable version, special care must be taken as to the location of the feedback resistors and

the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor,

especially an open core type of inductor.

WSON PACKAGE DEVICES

The LM2675 is offered in the 16 lead WSON surface mount package to allow for increased power dissipation

compared to the SOIC and PDIP.

The Die Attach Pad (DAP) can and should be connected to PCB Ground plane/island. For CAD and assembly

guidelines refer to Application Note AN-1187 (SNOA401).

Copyright © 2004–2005, Texas Instruments Incorporated

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