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LM2675M-3.3 Datasheet(PDF) 2 Page - Texas Instruments |
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LM2675M-3.3 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 30 page  1 2 3 4 7 8 9 10 5 6 11 12 13 14 15 16 CB * * * * FB * * VSW VSW VIN GND GND ON/OFF * No Connections * * DAP ** **Connect to Pins 11, 12 on PCB LM2675 SNVS129E – MAY 2004 – REVISED JUNE 2005 www.ti.com Typical Application Connection Diagram Figure 1. 16-Lead WSON Surface Mount Package Figure 2. 8-Lead SOIC/PDIP Package Top View Top View Package Drawing Number NHN0016A Package Drawing Number D0008A/P0008E These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM2675 |
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