RV4145A

PRODUCT SPECIFICATION

REV. 1.0.3 3/6/02

9

8-Lead SOIC Package

85

14

D

A

A1

– C –

ccc C

LEAD COPLANARITY

SEATING

PLANE

e

B

L

h x 45

°

C

α

EH

A

.053

.069

1.35

1.75

Symbol

Inches

Min.

Max.

Min.

Max.

Millimeters

Notes

A1

.004

.010

0.10

0.25

.020

0.51

B

.013

0.33

C

.008

.010

0.20

0.25

E

.150

.158

3.81

4.01

e

.228

.244

5.79

6.20

.010

.020

0.25

0.50

H

.050 BSC

1.27 BSC

h

L

.016

.050

0.40

1.27

0

°

8

°

0

°

8

°

3

6

5

2

2

N8

8

α

ccc

.004

0.10

——

D

.189

.197

4.80

5.00

Notes:

1.

2.

3.

4.

5.

6.

Dimensioning and tolerancing per ANSI Y14.5M-1982.

"D" and "E" do not include mold flash. Mold flash or

protrusions shall not exceed .010 inch (0.25mm).

"L" is the length of terminal for soldering to a substrate.

Terminal numbers are shown for reference only.

"C" dimension does not include solder finish thickness.

Symbol "N" is the maximum number of terminals.